SiPearl Lets Rhea Design Leak: 72x Zeus Cores, 4x HBM2E, 4-6 DDR5

In what seems to be a major blunder by the SiPearl PR team, a recent visit by a local French politician resulted in the public Twitter posting in what...

28 by Andrei Frumusanu on 9/8/2020

Arm Announces Cortex-R82: First 64-bit Real Time Processor

Arm is known for its Cortex range of processors in mobile devices, however the mainstream Cortex-A series of CPUs which are used as the primary processing units of devices...

28 by Andrei Frumusanu on 9/3/2020

Samsung Launches New Galaxy Z Fold2 at $1999

Samsung’s new Galaxy Z Fold2 had been originally announced several weeks ago alongside the Note20 series, however the company had been delaying the official launch of the phone until...

32 by Andrei Frumusanu on 9/1/2020

The ASUS ZenFone 7 Pro Review: The Triple Flip-Camera

ASUS last week released the brand new ZenFone 7 and ZenFone 7 Pro series, and today’s we’re ready to publish our testing of the company’s newest “mainsteam” flagship device. This...

31 by Andrei Frumusanu on 9/1/2020

Qualcomm Announces Snapdragon 732G: 730G Gets a Speed Bump

Today Qualcomm is announcing an update to its Snapdragon 730G platform, introducing the higher-binned Snapdragon 732G. The new chip gives the platform a slight boost in terms of clock...

16 by Andrei Frumusanu on 8/31/2020

Marvell Refocuses Thunder Server Platforms Towards Custom Silicon Business

Yesterday during Marvell’s quarterly earnings call, the company had made a surprise announcement that they are planning to restructure their server processor development team towards fully custom solutions, abandoning...

43 by Andrei Frumusanu on 8/28/2020

The ASUS ROG Phone III Review: A 144Hz 6000mAh Beast With Caveats

ASUS’s ROG Phones over the last few years have been devices of interesting differentiation, with the company delivering experiences that stood out from the crowd in one way or...

72 by Andrei Frumusanu on 8/28/2020

ASUS Announces ZenFone 7 Series: The Triple-Flip Camera - Hands-On

Today ASUS is announcing its follow-up to its innovative flip-camera design that was first introduced last year with the ZenFone 6. This year’s ZenFone 7 series, consisting of the...

80 by Andrei Frumusanu on 8/26/2020

2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package

High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the...

35 by Andrei Frumusanu on 8/25/2020

TSMC’s Version of EMIB is ‘LSI’: Currently in Pre-Qualification

Whilst process node technologies and Moore’s Law are slowing down, manufacturers and chip designers are looking to new creative solutions to further enable device and performance scaling. Advanced packaging...

19 by Andrei Frumusanu on 8/25/2020

TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production

At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the...

57 by Andrei Frumusanu on 8/24/2020

Hot Chips 2020: Marvell Details ThunderX3 CPUs - Up to 60 Cores Per Die, 96 Dual-Die in 2021

Today as part of HotChips 2020 we saw Marvell finally reveal some details on the microarchitecture of their new ThunderX3 server CPUs and core microarchitectures. The company had announced...

27 by Andrei Frumusanu on 8/17/2020

Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology

Yesterday, Samsung Electronics had announced a new 3D IC packaging technology called eXtended-Cube, or “X-Cube”, allowing chip-stacking of SRAM dies on top of a base logic die through TSVs. Current...

21 by Andrei Frumusanu on 8/14/2020

Microsoft Opens Pre-Orders for Surface Duo - US Only

Late last year in October, Microsoft had announced the Surface Duo, the company’s first ever Android device and first-party smartphone (if you can call it that) release in years...

68 by Andrei Frumusanu on 8/12/2020

Samsung Display Announces First VRR Mobile Display - Inside Note20 Ultra

By now we’ve become quite familiar with high refresh-rate displays in the mobile space, as the first pioneering 90Hz devices last year have now evolved into even faster refreshing...

31 by Andrei Frumusanu on 8/11/2020

US Appeals Court Reverses Antitrust Ruling in FTC vs Qualcomm

It’s been over three years since the United States FTC had charged Qualcomm with antitrust violations over cellular modem patents and business practices. That suit ultimately received a ruling...

23 by Andrei Frumusanu on 8/11/2020

OPPO's Reno3 5G vs Reno3 Pro vs Reno3 Pro 5G: Why Don't We See More MediaTek Dimensity 1000 Phones?

Today, we’ll be taking a closer look at one of MediaTek’s Dimensity 1000 powered phones, the OPPO Reno3 5G. The Reno3 series has been quite the oddball device line-up...

45 by Andrei Frumusanu on 8/10/2020

MediaTek Announces T700 5G Modem Powering Intel PCs Successfully Certified

Last year, Intel and MediaTek had announced a partnership with the goal of developing a 5G modem that would be used in future next-generation PC platforms. The move followed...

13 by Andrei Frumusanu on 8/6/2020

Samsung Announces Galaxy Tab S7 & S7+: S865+ & 120Hz Tablets

Today alongside the Note20 series smartphones, Samsung is also releasing a pair of new high-end tablets in the form of the new Tab S7 and Tab S7+. It’s been...

74 by Andrei Frumusanu on 8/5/2020

Samsung Announces Galaxy Z Fold 2: Second-Generation Foldable

Alongside the new Note20 series smartphones, Samsung is today pre-announcing the brand-new Galaxy Z Fold 2, the successor to last year’s quite controversial Galaxy Fold smartphone, a device which...

18 by Andrei Frumusanu on 8/5/2020

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